The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Nov. 15, 2016
Applicant:

Nippon Steel Welding & Engineering Co., Ltd, Tokyo, JP;

Inventors:

Kiyohito Sasaki, Tokyo, JP;

Rikiya Takayama, Tokyo, JP;

Yasuhito Totsuka, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); B23K 9/173 (2006.01); B23K 35/38 (2006.01); B23K 35/362 (2006.01); B23K 9/02 (2006.01); B23K 9/23 (2006.01); B23K 33/00 (2006.01); B23K 103/04 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0266 (2013.01); B23K 9/02 (2013.01); B23K 9/173 (2013.01); B23K 9/23 (2013.01); B23K 33/004 (2013.01); B23K 35/3073 (2013.01); B23K 35/362 (2013.01); B23K 35/3602 (2013.01); B23K 35/38 (2013.01); B23K 2103/04 (2018.08);
Abstract

A wire includes, in terms of % by mass with respect to a total mass of the wire, as a total in a steel outer skin and a flux, 0.03 to 0.09% of C, 0.1 to 0.6% of Si, 1.3 to 2.6% of Mn, 0.01 to 0.5% of Cu, 0.05 to 0.5% of Ti, 0.002 to 0.015% of B, and 0.05% or less of Al, and further including, in the flux, 5 to 9% in terms of TiO, 0.1 to 0.6% of in terms of SiO, 0.02 to 0.3% in terms of AlO, 0.1 to 0.8% of Mg, 0.05 to 0.3% in terms of F, 0.05 to 0.3% in terms of Na and K in a fluorine compound, 0.05 to 0.2% of NaO and KO, and 0.1% or less in terms of ZrO.


Find Patent Forward Citations

Loading…