The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

May. 01, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Arata Kishi, Fukuoka, JP;

Hiroki Maruo, Fukuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); H01L 23/00 (2006.01); B23K 1/00 (2006.01); C22C 12/00 (2006.01); B23K 101/36 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 35/26 (2013.01); B23K 35/264 (2013.01); C22C 12/00 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); B23K 2101/36 (2018.08); B23K 2103/08 (2018.08); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16501 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01083 (2013.01); H01L 2924/0665 (2013.01);
Abstract

A connecting method of a circuit member, includes: a first process of preparing a connection material that a solder material disperses in the adhesive; a second process of disposing the first circuit member and the second circuit member to cause the first electrode of the first circuit member and the second electrode of the second circuit member to oppose each other via the connection material; and a third process of compressing the first circuit member and the second circuit member while applying heat to the connection material. The third process includes a first pressing process which is performed before a temperature of the connection material reaches a melting point of the solder material, and a second pressing process which follows the first pressing process.


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