The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Sep. 25, 2018
Applicant:

Getac Technology Corporation, Hsinchu County, TW;

Inventor:

Wei-Chung Hsiao, Taipei, TW;

Assignee:

GETAC TECHNOLOGY CORPORATION, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01); H01L 23/373 (2006.01); F28F 3/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); F28F 3/00 (2013.01); H01L 23/3737 (2013.01); H05K 1/0203 (2013.01); H05K 1/0216 (2013.01); H05K 1/181 (2013.01); H05K 7/2039 (2013.01); H05K 7/20481 (2013.01); H05K 9/0024 (2013.01);
Abstract

A wave absorbing heat dissipation structure adapted to absorb electromagnetic waves of an electronic component and dissipate heat energy of the electronic component. The wave absorbing heat dissipation structure includes a wave absorbing heat dissipation layer and a metal film. The wave absorbing heat dissipation layer is provided at an electronic device, and has a first surface and a second surface opposite to each other, wherein the first surface covers the electronic component. The metal film covers the second surface. The wave absorbing heat dissipation layer is adapted to absorb electromagnetic waves and transmit heat energy. The metal film is adapted to reflect electromagnetic waves and dissipate heat energy. The wave absorbing heat dissipation structure is capable of alleviating interference of electromagnetic waves on an electronic component and enhancing heat dissipation of an electronic component.


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