The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Dec. 22, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Reinhold Bayerer, Reichelsheim, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/00 (2006.01); H05K 5/00 (2006.01); H01L 23/00 (2006.01); H05K 7/14 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01); H05K 7/20 (2006.01); H01L 23/10 (2006.01); H01L 23/16 (2006.01); H01L 23/373 (2006.01); H01L 23/24 (2006.01); H05K 3/28 (2006.01); H01L 23/40 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
H05K 7/14 (2013.01); H01L 23/10 (2013.01); H01L 23/16 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H05K 1/0203 (2013.01); H05K 1/0209 (2013.01); H05K 1/18 (2013.01); H05K 5/0239 (2013.01); H05K 7/2039 (2013.01); H01L 23/053 (2013.01); H01L 23/4006 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01); H05K 1/0271 (2013.01); H05K 3/284 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/066 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10598 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/302 (2013.01);
Abstract
One aspect relates to a method for producing an electronic module assembly. According to the method, a curable first mass extending between a substrate assembly and a module housing is cured while a circuit carrier of the substrate assembly has at least a first temperature. Between a side wall of the module housing and the substrate assembly, an adhesive connection is formed by curing a curable second mass. Subsequent to curing the first mass, the circuit carrier is cooled down to below a second temperature lower than the first temperature. Embodiments of the electronic module assembly are also described.