The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Oct. 19, 2016
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventor:

Uwe Liskow, Asperg, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 5/06 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0082 (2013.01); H05K 1/144 (2013.01); H05K 3/28 (2013.01); H05K 3/368 (2013.01); H05K 5/0069 (2013.01); H05K 5/06 (2013.01); H05K 5/062 (2013.01); H05K 2201/047 (2013.01);
Abstract

An electronic module includes a first circuit board. The first circuit board has electronic components, spacers, a cover plate, and a casting compound. The spacers are positioned so as to rest at least in corner regions of the first circuit board. The cover plate is positioned on the spacers. The casting compound acts as an end face and seals a gap formed by the spacers between the first circuit board and the cover plate, so as to form a housing for the electronic components, which are positioned therein. The casting compound secures the cover plate to the first circuit board via positive engagement. A coefficient of linear thermal expansion of the casting compound corresponds substantially to a coefficient of linear thermal expansion of the circuit board and of the cover plate.


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