The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Jun. 24, 2014
Applicant:
President and Fellows of Harvard College, Cambridge, MA (US);
Inventors:
Jennifer A. Lewis, Cambridge, MA (US);
Michael A. Bell, Somerville, MA (US);
Travis A. Busbee, Somerville, MA (US);
John E. Minardi, II, Somerville, MA (US);
Assignee:
President and Fellows of Harvard College, Cambridge, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/12 (2006.01); H01L 23/13 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); H01M 4/04 (2006.01); H05K 7/02 (2006.01); B29C 70/72 (2006.01); H04R 25/00 (2006.01); B29C 64/00 (2017.01); B29C 64/106 (2017.01); H01M 4/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/125 (2013.01); B29C 64/00 (2017.08); B29C 64/106 (2017.08); B29C 70/72 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H01L 21/4803 (2013.01); H01L 21/4867 (2013.01); H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 23/3107 (2013.01); H01L 23/49822 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/27 (2013.01); H01L 24/743 (2013.01); H01L 24/75 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/065 (2013.01); H01L 25/50 (2013.01); H01M 4/0411 (2013.01); H04R 25/658 (2013.01); H05K 1/0284 (2013.01); H05K 3/1241 (2013.01); H05K 7/02 (2013.01); H01L 21/568 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1815 (2013.01); H01M 2004/022 (2013.01); H05K 1/185 (2013.01);
Abstract
A printed 3D functional part includes a 3D structure comprising a structural material, and at least one functional electronic device is at least partially embedded in the 3D structure. The functional electronic device has a base secured against an interior surface of the 3D structure. One or more conductive filaments are at least partially embedded in the 3D structure and electrically connected to the at least one functional electronic device.