The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Mar. 16, 2018
Applicant:

Carnegie Mellon University, Pittsburgh, PA (US);

Inventors:

Gary K. Fedder, Turtle Creek, PA (US);

Carmel Majidi, Pittsburgh, PA (US);

Philip R. LeDuc, Wexford, PA (US);

Lee E. Weiss, Pittsburgh, PA (US);

Christopher J. Bettinger, Pittsburgh, PA (US);

Naser Naserifar, Pittsburgh, PA (US);

Assignee:

CARNEGIE MELLON UNIVERSITY, Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); B29C 33/40 (2006.01); H01L 21/48 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); H05K 5/06 (2006.01); B05D 3/10 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); B29C 33/40 (2013.01); H01L 21/4803 (2013.01); H05K 1/02 (2013.01); H05K 1/185 (2013.01); H05K 3/30 (2013.01); H05K 3/38 (2013.01); H05K 3/4644 (2013.01); A61B 2562/125 (2013.01); A61B 2562/164 (2013.01); B05D 3/10 (2013.01); B05D 3/107 (2013.01); B05D 3/108 (2013.01); H01L 23/3121 (2013.01); H05K 5/065 (2013.01); H05K 2201/1003 (2013.01);
Abstract

A flexible and stretchable integrated electronic device comprising a substrate having a stiffness gradient, wherein a rigid electronic device is embedded within the substrate. The stiffness gradient within the substrate prevents delamination at the interface between the substrate and the embedded device. A method of fabricating an integrated electronic device having a stiffness gradient comprises applying a curing agent to an uncured polymer base material.


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