The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Apr. 05, 2016
Applicant:

Harman International Industries, Inc., Stamford, CT (US);

Inventors:

Elijah Auger, Fenton, MI (US);

Sabin Oana, Howell, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 7/14 (2006.01); H05K 9/00 (2006.01); H01Q 1/50 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H01Q 1/50 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 7/142 (2013.01); H05K 9/0033 (2013.01); H05K 9/0039 (2013.01); H05K 2201/0707 (2013.01); H05K 2201/10098 (2013.01);
Abstract

An electronic device including a substrate having opposing top and bottom surfaces is provided. A ground layer is disposed in the substrate. An electrically conductive chassis has a mounting surface to receive the bottom surface of the substrate and is in electrical contact with the ground layer by a ground stitch via. An electromagnetic shield is defined by the ground layer, the ground stitch via and the chassis to enclose the bottom surface of the substrate and protect the bottom surface from electromagnetic interference. A non-conductive cover is assembled to the substrate in tension so that an interior surface of the cover applies a force to the top surface of the substrate thereby ensuring the chassis maintains electrical contact with the ground layer.


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