The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Feb. 02, 2017
Applicant:

Sabic Global Technologies, B.v., Bergen op Zoom, NL;

Inventors:

Hao Zhou, Mt. Vernon, IN (US);

Seongnam Lee, Seoul-si, KR;

Jong-Min Choi, Seongnam, KR;

Jong Woo Lee, Seoul, KR;

Assignee:

SABIC GLOBAL TECHNOLOGIES B.V., Bergen op Zoom, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/02 (2006.01); B32B 7/12 (2006.01); B32B 17/06 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
H04M 1/0268 (2013.01); B32B 7/12 (2013.01); B32B 17/064 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 2307/412 (2013.01); B32B 2457/20 (2013.01); B32B 2457/208 (2013.01);
Abstract

A foldable cover assembly includes a glass layer having a first surface, a second surface opposite the first surface, a first thickness at a first location and a second thickness at a second location, wherein the second thickness is less than the first thickness. The second thickness is further effective to provide bendability to the glass layer. The foldable cover assembly further includes an optically clear polymer film disposed on the first surface of the glass layer. The polymer film includes a thermoplastic polymer, a thermoset polymer, or a combination comprising at least one of the foregoing, wherein a 100 micrometer-thick sample of the optically clear polymer film transmits greater than 85% of visible light as determined according to ASTM D1003-00. A method for the manufacture of the foldable cover assembly is also described. The foldable cover assembly can be useful for use with an electronic device.


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