The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Jun. 14, 2017
Applicant:

Jtekt Corporation, Osaka-shi, Osaka, JP;

Inventors:

Takahito Hieda, Kashihara, JP;

Kouya Yoshida, Okazaki, JP;

Naoki Tani, Kashiwara, JP;

Assignee:

JTEKT CORPORATION, Osaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 11/33 (2016.01); H02K 9/22 (2006.01); H02M 7/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H02K 11/33 (2016.01); H02K 9/22 (2013.01); H02M 7/003 (2013.01); H01L 23/3675 (2013.01);
Abstract

In a driving unit of an electromechanical motor unit, a semiconductor chip and a smoothing capacitor are joined to a second main surface of a substrate having a first main surface and the second main surface. The semiconductor chip includes a first end portion facing the second main surface, and a second end portion on the opposite side of the semiconductor chip from the first end portion. The smoothing capacitor includes a third end portion facing the second main surface, and a fourth end portion on the opposite side of the smoothing capacitor from the third end portion. The semiconductor chip is thermally connected to a bottom wall portion of a cover member, at a position closer to the second main surface than the fourth end portion is. The bottom wall portion is thermally connected to the motor housing via a sidewall portion of the cover member.


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