The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Mar. 29, 2018
Applicant:

Tyco Electronics Japan G.k., Kanagawa, JP;

Inventor:

Hidenori Taguchi, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/57 (2011.01); H01R 12/71 (2011.01); H01R 12/72 (2011.01); H01R 43/02 (2006.01); H05K 3/34 (2006.01); H01R 12/58 (2011.01); H01R 4/02 (2006.01);
U.S. Cl.
CPC ...
H01R 12/57 (2013.01); H01R 12/716 (2013.01); H01R 12/727 (2013.01); H01R 43/0249 (2013.01); H01R 43/0256 (2013.01); H01R 43/0263 (2013.01); H05K 3/34 (2013.01); H01R 4/028 (2013.01); H01R 12/58 (2013.01); H05K 2203/041 (2013.01);
Abstract

A socket comprises a housing made of an insulating board and a plurality of contacts arranged on a first surface of the housing. The housing has a plurality of passageways. Each passageway extends through the housing and has an inner wall surface plated with a conductive material. The housing also has a conductive pad formed on a second surface of the housing so as to correspond to one of the passageways. The conductive pad is electrically continuous with the conductive material of the inner wall surface of the passageway and extends from the passageway. The housing also has a solder ball attached to the conductive pad. Each of the contacts corresponds to one of the plurality of passageways and is electrically connected to both the conductive material of the inner wall surface of the passageway and a contact pad of an electronic component.


Find Patent Forward Citations

Taguchi, Hidenori. (2019). Socket receiving an electronic component having a plurality of contact pads (U.S. Patent No. 10461447). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10461447

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…