The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Jan. 03, 2018
Applicant:
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v., Munich, DE;
Inventors:
Ivan Ndip, Berlin, DE;
Tanja Braun, Berlin, DE;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01L 25/10 (2006.01); H01Q 15/02 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/73 (2013.01); H01L 25/105 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/73259 (2013.01); H01Q 15/02 (2013.01);
Abstract
A wafer level package with integrated antenna includes a contacting layer, a redistribution layer as well as a chip layer arranged between the contacting layer and the redistribution layer. An antenna is integrated in the redistribution layer. The antenna is shielded from the chip by means of a via, offset and provided with a reflector. Alternatively, the antenna can also be provided as antenna element in the chip layer.