The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Apr. 08, 2017
Applicant:

Beihang University, Beijing, CN;

Inventors:

Zhaowen Yan, Beijing, CN;

Jianwei Wang, Beijing, CN;

Wei Zhang, Beijing, CN;

Donglin Su, Beijing, CN;

Assignee:

BEIHANG UNIVERSITY, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); G01R 29/08 (2006.01); H05K 1/02 (2006.01); G01R 31/00 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
H01P 3/08 (2013.01); G01R 29/0878 (2013.01); G06F 17/50 (2013.01); H05K 1/0251 (2013.01); G01R 31/001 (2013.01); H05K 1/0222 (2013.01);
Abstract

An impedance compensation structure for a broadband near-field magnetic-field probe, includes: a signal via; and a plurality of grounding vias provided around the signal via to form a coaxial via array; wherein the grounding via and the signal via have an identical size, all distances of each of the plurality of the grounding vias to the signal via are equal, and the plurality of the grounding vias forms a circle centered at the signal via; wherein each of the plurality of the grounding vias is connected with a magnetic field probe top layer shield plane and a magnetic field probe bottom layer shield plane; each of the plurality of the grounding vias keeps in a conducting state from a direct current to a high frequency, in such a manner that impedance matching of the broadband near-field magnetic-field probe is achieved.


Find Patent Forward Citations

Yan, Zhaowen. (2019). Impedance compensation structure for broadband near-field magnetic-field probe and its construction method (U.S. Patent No. 10461386). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10461386

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