The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Dec. 04, 2017
Applicant:

Interdisciplinary Consulting Corp., Gainesville, FL (US);

Inventor:

David Alan Mills, Gainesville, FL (US);

Assignee:

INTERDISCIPLINARY CONSULTING CORP., Gainesville, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/08 (2006.01); H01L 41/047 (2006.01); H01L 41/053 (2006.01); H01L 41/113 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); G01L 9/00 (2006.01); G01L 19/00 (2006.01); G01L 9/08 (2006.01); H01L 41/332 (2013.01); H01L 41/187 (2006.01); H01L 41/314 (2013.01); G01L 9/12 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0475 (2013.01); G01L 9/0005 (2013.01); G01L 19/0069 (2013.01); H01L 23/13 (2013.01); H01L 24/48 (2013.01); H01L 41/0533 (2013.01); H01L 41/1132 (2013.01); G01L 9/08 (2013.01); G01L 9/12 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 41/187 (2013.01); H01L 41/314 (2013.01); H01L 41/332 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73215 (2013.01); H01L 2924/35 (2013.01);
Abstract

A microscale sensor structure is provided that enables backside electrical connection to flush-mounted microscale sensors without through-wafer-vias (TWVs). A flush-mounted microscale sensor can be fabricated without TWVs by providing a sensor support substrate with openings for electrical connection access to the backside of a device layer. Backside electrical connection is made to the sensing element(s) of the device layer through the openings in the support substrate. Electrical isolation of the sensing element(s) from the support substrate is accomplished through use of an insulating support substrate and/or an insulating layer between the support substrate and the device layer.


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