The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Sep. 08, 2017
Applicant:
Nichia Corporation, Anan-shi, Tokushima, JP;
Inventors:
Tomohiro Ikeda, Komatsushima, JP;
Masaaki Katsumata, Anan, JP;
Yohei Inayoshi, Komatsushima, JP;
Yosuke Nakayama, Komatsushima, JP;
Yumiko Kameshima, Anan, JP;
Assignee:
NICHIA CORPORATION, Anan-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 33/64 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/647 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2933/0075 (2013.01); H05K 1/189 (2013.01); H05K 3/0061 (2013.01); H05K 2201/10106 (2013.01);
Abstract
A method for manufacturing a metal-base substrate includes: preparing a film substrate by forming a wiring layer on a first surface of the film substrate; and sticking a metal plate on a second surface of the film substrate opposite from the first surface, with an adhesive layer being interposed between the metal plate and the film substrate.