Condensation reaction-type die bonding agent, led light emitting device and method for manufacturing same

Abstract

A condensation reaction-type die bonding agent has little liability of poor electrical connection at the electrodes. A condensation reaction-type die bonding agent for bonding an LED device provided on its surface with device electrodes having connection surfaces covered by gold, where the die bonding agent includes (A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (T) expressed by RSiOwhere, Rindicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups, (B) a polysilsesquioxane liquid in state at room temperature having trisiloxy units (T) expressed by RSiOwhere, Rindicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —ORwhere, Rindicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and (C) a condensation reaction catalyst.