The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Sep. 05, 2018
Applicant:
Int Tech Co., Ltd., Hsinchu County, TW;
Inventors:
Assignee:
INT TECH CO., LTD., Hsinchu County, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3246 (2013.01); H01L 51/0018 (2013.01); H01L 51/5036 (2013.01); H01L 51/5056 (2013.01); H01L 51/5072 (2013.01); H01L 51/5088 (2013.01); H01L 51/56 (2013.01); H01L 27/3211 (2013.01); H01L 51/0097 (2013.01); H01L 2251/5338 (2013.01);
Abstract
A method of manufacturing a light emitting device includes providing a substrate, forming a plurality of photosensitive bumps over the substrate, forming a photosensitive layer over the plurality of photosensitive bumps, forming a buffer layer between the photosensitive layer and the plurality of photosensitive bumps, patterning the photosensitive layer to form a recess through the photosensitive layer to expose a surface, disposing an organic emissive layer on the surface, forming a metal containing layer over the organic emissive layer, and removing the patterned photosensitive layer.