The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Aug. 07, 2017
Applicant:

Invensense, Inc., San Jose, CA (US);

Inventors:

Renata Melamud Berger, Palo Alto, CA (US);

Julius Ming-Lin Tsai, San Jose, CA (US);

Stephen Lloyd, Los Altos, CA (US);

Assignee:

InvenSense, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/24 (2006.01); H01L 41/113 (2006.01); G06K 9/00 (2006.01); H01L 41/08 (2006.01); H01L 27/20 (2006.01); G01N 29/28 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/20 (2013.01); B81C 1/00246 (2013.01); G01N 29/2437 (2013.01); G01N 29/28 (2013.01); G06K 9/0002 (2013.01); H01L 41/0825 (2013.01); H01L 41/1132 (2013.01); H01L 41/1138 (2013.01);
Abstract

An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.


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