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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10461065 B1

PDFFull Text
Date of Patent:
Oct. 29, 2019

Filed:

Nov. 30, 2016

Method of manufacturing light emitting device

Applicant:

Nichia Corporation, Anan-shi, JP;

Inventors:

Kenji Ozeki, Tokushima, JP;

Hiroki Fukuta, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:

Mori & Ward, LLP

Primary Examiner:

Jose R Diaz

Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/00 (2010.01); H01L 33/56 (2010.01); H01L 23/24 (2006.01); H01L 25/07 (2006.01); H01L 25/075 (2006.01); H01L 27/02 (2006.01); H01L 29/866 (2006.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 24/26 (2013.01); H01L 24/73 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 33/0095 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 23/24 (2013.01); H01L 25/072 (2013.01); H01L 25/0753 (2013.01); H01L 27/0248 (2013.01); H01L 29/866 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/26155 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/1811 (2013.01); H01L 2924/19105 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A method of manufacturing a light emitting device includes: mounting light emitting elements on a collective substrate; arranging a first protruding member surrounding the light emitting elements; arranging a second protruding member between the light emitting elements; forming a cover member covering an upper end of the second protruding member, a lateral surface of each of the light emitting elements in a region surrounded by the first protruding member; and singulating the light emitting devices by cutting the cover member, the second protruding member, and the collective substrate at a portion including the second protruding member. The second protruding member is harder than the cover member. An upper end of the second protruding member is located lower than that of the first protruding member but higher than the upper surface of each of the light emitting elements.

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