The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Feb. 27, 2017
Applicant:

Shashin Kagaku Co., Ltd., Kyoto, JP;

Inventor:

Hiroyuki Kitazawa, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G09F 9/33 (2006.01); H05K 13/04 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 24/743 (2013.01); G09F 9/33 (2013.01); H01L 24/83 (2013.01); H01L 33/0095 (2013.01); H05K 13/04 (2013.01); H05K 13/0404 (2013.01); H01L 2924/06 (2013.01); H01L 2924/12041 (2013.01);
Abstract

[Object] To provide a method and an apparatus for manufacturing electronic devices by transferring the device chips from one substrate for producing device chips to the other substrate for a product having a large display. [Means of Realizing the Object] A substrate having a plurality of device chips is brought into contact with a first drum including a selective adhesive region, the device chips are transferred by making the device chips be adhered to the selective adhesive layer of the first drum and separating at least part of the device chips from the substrate by rotating the first drum, then, the device chips on the first drum are made to be come into contact with the other substrate for the product, and the device chips are transferred to the substrate for the product by rotating the first drum. Additionally, the front-and-rear relation for the surfaces may be inversed by, after the device chips on the first drum are transferred to the second drum, transferring the device chips on the second drum to the substrate for the product.


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Kitazawa, Hiroyuki. (2019). Method and apparatus for manufacturing electronic device using device chip (U.S. Patent No. 10461058). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10461058

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