The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Sep. 30, 2016
Applicant:

Nxp B.v., Eindhoven, NL;

Inventor:

Christian Zenz, Gratkorn, AT;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01Q 1/22 (2006.01); G06K 19/077 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); G06K 19/07747 (2013.01); G06K 19/07749 (2013.01); G06K 19/07754 (2013.01); G06K 19/07769 (2013.01); H01L 24/08 (2013.01); H01L 24/85 (2013.01); H01Q 1/2208 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/08111 (2013.01); H01L 2224/08501 (2013.01); H01L 2224/4912 (2013.01); H01L 2224/85355 (2013.01);
Abstract

The disclosure relates to a dual-interface integrated circuit (IC) card module for use in a dual-interface IC card. Embodiments disclosed include a dual-interface integrated circuit card module (), the module comprising: a substrate () having first and second opposing surfaces; a contact pad () on the first surface of the substrate; an integrated circuit () on the second surface of the substrate (), the integrated circuit () having electrical connections to the contact pad () through the substrate (); and a pair of antenna pads () disposed in recesses () in the second surface of the substrate () and electrically connected to corresponding antenna connections on the integrated circuit ().


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