The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Mar. 20, 2015
Applicant:
Dexerials Corporation, Tokyo, JP;
Inventors:
Yasushi Akutsu, Utsunomiya, JP;
Yuta Araki, Tochigi, JP;
Assignee:
DEXERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/00 (2018.01); H01J 23/00 (2006.01); B32B 27/20 (2006.01); C09J 9/02 (2006.01); B32B 27/08 (2006.01); H01L 23/00 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 24/27 (2013.01); H01B 1/22 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/2743 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/27515 (2013.01); H01L 2224/294 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29357 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32501 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81488 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83488 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/381 (2013.01);
Abstract
An anisotropic conductive film that can be produced in high productivity and can reduce a short circuit occurrence ratio has a first conductive particle layer in which conductive particles are dispersed at a predetermined depth in a film thickness direction, and a second conductive particle layer in which conductive particles are dispersed at a depth different from that in the first conductive particle layer. In the respective conductive particle layers, the closest distances between the adjacent conductive particles are 2 times or more the average particle diameters of the conductive particles.