The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Oct. 19, 2017
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;
Hidekazu Tanisawa, Tsukuba, JP;
Shinji Sato, Tsukuba, JP;
Fumiki Kato, Tsukuba, JP;
Hiroshi Sato, Tsukuba, JP;
Kenichi Koui, Tsukuba, JP;
Hiroki Takahashi, Tsukuba, JP;
Yoshinori Murakami, Yokohama, JP;
FUJI ELECTRIC CO., LTD., Kawasaki-shi, Kanagawa, JP;
Abstract
An object of the present invention is to stabilize and strengthen the strength of a bonding part between a metal electrode on a semiconductor chip and metal wiring connected thereto using a simple structure. Provided is a semiconductor device including a metal layeron a surface of a metal electrodeformed on a semiconductor chip, the metal layerconsisting of a metal or an alloy different from a constituent metal of the metal electrode, metal wiringis connected to the metal layervia a bonding part, wherein the constituent metal of the metal layeris a metal or an alloy different from the constituent metal of the metal electrode, and the bonding parthas an alloy region harder than the metal wiring