The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Aug. 28, 2018
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Stephen Craig Parker, Burlington, NC (US);

James Edwin Culler, Jr., Lexington, NC (US);

Donald Joseph Leahy, Kernersville, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H05K 9/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H05K 9/0088 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01);
Abstract

The present disclosure provides electromagnetic shielding for integrated circuit (IC) modules. First, a precursor package with a number of IC modules is provided. The precursor package is then placed onto a chemical resistant tape. After a sweller process and a desmear process are performed, the chemical resistant tape is removed. Next, the precursor package is singulated to form a number of individual IC modules. The individual IC modules are placed onto a carrier tape, such that a bottom surface of each individual IC module is covered by the carrier tape, and a top surface and side surfaces of each individual IC module are exposed. A shielding structure is applied completely over the top surface and the side surfaces of each individual IC module. Herein, the shielding structure is electrically coupled to a ground plane within each individual IC module.


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