The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Jul. 09, 2018
Dongguan China Advanced Ceramic Technology Co., Ltd., Dongguan, Guangdong, CN;
Zhaohui Wu, Dongguan, CN;
Wei Kang, Dongguan, CN;
Xiaoquan Guo, Dongguan, CN;
Jun Zhang, Dongguan, CN;
DONGGUAN CHINA ADVANCED CERAMIC TECHNOLOGY CO., LTD., Dongguan, Guangdong, CN;
Abstract
A ceramic module for power semiconductor integrated packaging and a preparation method thereof are disclosed. The ceramic module includes a ceramic substrate and an integrated metal dam layer. By providing the integral metal dam layer on the upper surface of the ceramic substrate and forming cavities around die bonding regions, the semiconductor chip can be hermetically sealed. By providing a heat dissipation layer on the lower surface of the ceramic substrate, the heat generated by the semiconductor chip can be quickly conducted to the outside. The product has a simple production process and high product consistency.