The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Nov. 17, 2015
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Masayuki Yokota, Suita, JP;
Masaharu Yamamoto, Suita, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01); H01L 23/10 (2006.01); H01L 23/02 (2006.01); H03H 3/02 (2006.01); H03H 9/02 (2006.01); H01L 23/04 (2006.01); H01L 23/06 (2006.01); H03H 9/10 (2006.01); H03H 9/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 23/02 (2013.01); H01L 23/04 (2013.01); H01L 23/06 (2013.01); H03H 3/02 (2013.01); H03H 9/02 (2013.01); H03H 9/1071 (2013.01); H03H 9/133 (2013.01); H01L 2224/16 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/16195 (2013.01);
Abstract
This method for manufacturing a hermetic sealing lid member () includes forming a Ni plated metal plate () by forming a Ni plated layer () on a surface of a metal plate () having a corrosion resistance and forming the hermetic sealing lid member by punching the Ni plated metal plate.