The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Sep. 04, 2015
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Cheng-Wei Cheng, White Plains, NY (US);
Ning Li, White Plains, NY (US);
Devendra K. Sadana, Pleasantville, NY (US);
Kuen-Ting Shiu, Yorktown Heights, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01L 21/3205 (2006.01); H01L 21/306 (2006.01); H01L 21/205 (2006.01); H01L 21/285 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01L 21/0245 (2013.01); H01L 21/02293 (2013.01); H01L 21/02455 (2013.01); H01L 21/02538 (2013.01); H01L 21/2056 (2013.01); H01L 21/28556 (2013.01); H01L 21/30604 (2013.01); H01L 21/32051 (2013.01);
Abstract
A method comprises providing a sacrificial release layer on a base substrate; forming a device layer on the sacrificial release layer; depositing a metal stressor layer on the device layer; etching the sacrificial release layer; and using epitaxial lift off to release the device layer and the metal stressor layer from the base substrate.