The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Mar. 23, 2017
Applicant:

SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;

Inventor:

Sang Gu Jo, Bucheon-si, KR;

Assignee:

SK hynix Inc., Icheon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 29/00 (2006.01); G06F 3/06 (2006.01); G11C 29/18 (2006.01); G11C 29/42 (2006.01); G11C 5/04 (2006.01);
U.S. Cl.
CPC ...
G11C 29/765 (2013.01); G06F 3/0619 (2013.01); G06F 3/0638 (2013.01); G06F 3/0655 (2013.01); G06F 3/0679 (2013.01); G11C 29/18 (2013.01); G11C 29/42 (2013.01); G11C 5/04 (2013.01);
Abstract

A semiconductor system includes a medium controller and a semiconductor module. The medium controller outputs an address that is sequentially counted in a test mode, senses levels of data corresponding to the address in the test mode to determine if the data has a row error or a chip error, and changes a combination of a host address to generate and store a spare address if a combination of the address corresponds to the chip error in the test mode. The semiconductor module includes a plurality of semiconductor devices. The semiconductor module repairs the address to output the data from a redundancy area if a combination of the address corresponds to the row error. The semiconductor module outputs the data from a spare area selected by the spare address if a combination of the address corresponds to the chip error.


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