The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Apr. 15, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ronald D. Rose, Essex Junction, VT (US);

Vladimir Zolotov, Putnam Valley, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5077 (2013.01); G06F 17/5072 (2013.01); G06F 17/5081 (2013.01); G06F 2217/82 (2013.01); G06F 2217/84 (2013.01);
Abstract

A system for semiconductor chip fabrication. A host system hosts a capacitance adjust tool for performing calculating a ground capacitance adjust for a wire segment going through routing tiles according to the following operations; providing the routing tiles having a plurality of wires wherein the wire segment being a victim wire and neighboring wires being aggressor wires; computing ground capacitance adjusts for a victim wire averaged across all aggressor slew values and across possible spacing values between the victim wire and the neighboring aggressor wires to take into account a potential coupling effect by the neighboring aggressor wires, to guide placement of the wire segment in the routing tiles to avoid coupling noise; and outputting the placement of the wire segments to a tool for manufacturing the semiconductor chip.


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