The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Nov. 24, 2014
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui Province, CN;

Inventors:

Linlin Wang, Beijing, CN;

Zhiyu Qian, Beijing, CN;

Qinglong Meng, Beijing, CN;

Yinchu Zhao, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/13357 (2006.01); G02F 1/13 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1336 (2013.01); G02F 1/1303 (2013.01); G02F 1/1309 (2013.01); Y10T 29/53 (2015.01);
Abstract

A dismantling device and a method for dismantling a backlight unit are provided, and the dismantling method includes: placing a liquid crystal module that includes a liquid crystal panel and a backlight unit placed oppositely and connected by a bonding portion onto a supporting table; bringing a line cutting portion that includes two ends and a cutting line therebetween into a gap between the liquid crystal panel and the backlight unit, with at least one of the two ends and the liquid crystal module configured to be movable with respect to each other; and applying a cutting force upon the bonding portion with the line cutting portion along a plane where the bonding portion is located, so as to separate the backlight unit from the liquid crystal panel. This method decreases the force upon the backlight unit to reduce chances of damaging the backlight unit during dismantling the same.


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