The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Mar. 31, 2015
Applicant:

Unitechno, Inc., Tokyo, JP;

Inventors:

Tomoaki Adachi, Tokyo, JP;

Munehiro Yamada, Tokyo, JP;

Assignee:

UNITECHNO, INC., Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 31/28 (2006.01); G01R 31/26 (2014.01); G01R 1/073 (2006.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2893 (2013.01); G01R 1/0466 (2013.01); G01R 1/0735 (2013.01); G01R 31/26 (2013.01);
Abstract

A semiconductor test apparatus capable of securely having the contact pin and the external contact terminal held in contact with each other even in case where the vertical type handler is used. The semiconductor test apparatus comprises: a test socket having a socket surface formed thereon, the socket surface having a contact pin towering therefrom; and a semiconductor transport fixture having a concave portion formed thereon, the concave portion adapted to receive therein an IC under test, wherein the test socket has a position adjustment guide provided thereon, the semiconductor transport fixture has a guide through bore formed therein, the guide through bore adapted to receive the position adjustment guide therethrough when the IC under test comes under test, and either one of the position adjustment guide or the guide through bore is formed in a tapered shape.


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