The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Jan. 05, 2017
Applicant:

Johnson Controls Technology Company, Plymouth, MI (US);

Inventors:

Jay A. Kohler, York, PA (US);

Patrick Christian Marks, York, PA (US);

Ian Michael Casper, York, PA (US);

Kurt Devlin, York, PA (US);

Assignee:

Johnson Controls Technology Company, Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 39/02 (2006.01); F25B 43/00 (2006.01); F25B 41/06 (2006.01); F28F 9/00 (2006.01); F25B 40/02 (2006.01); F28D 7/16 (2006.01); F28D 21/00 (2006.01); F25B 25/00 (2006.01); F28F 19/00 (2006.01);
U.S. Cl.
CPC ...
F25B 43/006 (2013.01); F25B 39/02 (2013.01); F25B 39/028 (2013.01); F25B 41/062 (2013.01); F28F 9/005 (2013.01); F25B 25/005 (2013.01); F25B 40/02 (2013.01); F25B 2339/0242 (2013.01); F25B 2339/047 (2013.01); F25B 2341/0661 (2013.01); F25B 2341/0662 (2013.01); F25B 2400/13 (2013.01); F25B 2400/23 (2013.01); F25B 2500/01 (2013.01); F25B 2600/0253 (2013.01); F25B 2600/2513 (2013.01); F25B 2700/171 (2013.01); F25B 2700/21162 (2013.01); F25B 2700/21163 (2013.01); F28D 7/16 (2013.01); F28D 2021/0063 (2013.01); F28D 2021/0071 (2013.01); F28F 19/002 (2013.01); Y02B 30/741 (2013.01);
Abstract

Embodiments of the present disclosure relate to a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system that includes a refrigerant loop, a compressor disposed along the refrigerant loop and configured to circulate refrigerant through the refrigerant loop, and an evaporator disposed along the refrigerant loop and configured to place the refrigerant in thermal communication with a cooling fluid, where the refrigerant surrounds a tube bundle disposed in the evaporator, the tube bundle is configured to flow the cooling fluid, and the evaporator has a height based at least on a target height of a liquid level of refrigerant in the evaporator, the evaporator includes a discharge configured to direct the vapor refrigerant from the evaporator to an inlet of the compressor, and an interface between the discharge and the inlet is without a bend.


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