The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Dec. 17, 2016
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

John A. Woleader, Pomona, CA (US);

Andrew R. Streett, San Clemente, CA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16B 11/00 (2006.01); B32B 37/12 (2006.01); B29C 65/54 (2006.01); B29C 65/00 (2006.01); B29L 31/30 (2006.01); B29C 37/04 (2006.01);
U.S. Cl.
CPC ...
F16B 11/006 (2013.01); B29C 65/542 (2013.01); B29C 66/12441 (2013.01); B29C 66/342 (2013.01); B29C 66/3452 (2013.01); B29C 66/5344 (2013.01); B29C 66/53241 (2013.01); B29C 66/55 (2013.01); B32B 37/1284 (2013.01); B29C 37/04 (2013.01); B29C 66/004 (2013.01); B29C 66/1122 (2013.01); B29C 66/32 (2013.01); B29C 66/721 (2013.01); B29C 66/742 (2013.01); B29C 66/861 (2013.01); B29L 2031/3097 (2013.01); Y10T 403/477 (2015.01);
Abstract

A method of forming an injection-bonded joint includes providing a first part and a second part having a second part upper edge and a second part lower edge, and forming a chamber wall within a bondline region between mating surfaces of the first part and the second part. The chamber wall divides a bondline length of the bondline region and defines at least one adhesive chamber. The method further includes forming a bondline dam along each of the second part upper edge and the second part lower edge in a manner such that the chamber wall, the bondline dams, and the mating surfaces collectively enclose the adhesive chamber having a chamber upper edge and a chamber lower edge. The method also includes injecting a structural adhesive into the adhesive chamber through an injection port and discharging excess adhesive from the adhesive chamber through a bleed hole.


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