The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Jul. 21, 2017
Applicant:
United Technologies Corporation, Farmington, CT (US);
Inventors:
John Harner, Vernon, CT (US);
John D. Riehl, Hebron, CT (US);
William Bogue, Hebron, CT (US);
Gary A. Wigell, Lansing, MI (US);
Brandon A. Gates, DeWitt, MI (US);
Michael A. Morden, Holt, MI (US);
Thomas M. Morin, Terryville, CT (US);
Assignee:
UNITED TECHNOLOGIES CORPORATION, Farmington, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 11/12 (2006.01); B64F 5/40 (2017.01); C25D 11/02 (2006.01); C25D 11/08 (2006.01); C25D 11/26 (2006.01); F01D 5/28 (2006.01); F02C 3/04 (2006.01); C25D 11/04 (2006.01); C25D 17/00 (2006.01);
U.S. Cl.
CPC ...
C25D 11/12 (2013.01); B64F 5/40 (2017.01); C25D 11/022 (2013.01); C25D 11/04 (2013.01); C25D 11/08 (2013.01); C25D 11/26 (2013.01); C25D 17/005 (2013.01); F01D 5/288 (2013.01); F02C 3/04 (2013.01); F05D 2230/90 (2013.01);
Abstract
A method for anodizing a bonded assembly may include attaching a first electrode to a first component of the bonded assembly, and forming a first oxide layer on the first component. The bonded assembly may comprise the first component and a second component bonded to the first component. The second component may be electrically isolated from the first component.