The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Oct. 21, 2015
Applicant:
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Inventors:
Kozo Ogi, Tokyo, JP;
Kenichi Inoue, Tokyo, JP;
Atsushi Ebara, Tokyo, JP;
Akihiro Asano, Tokyo, JP;
Hideyuki Fujimoto, Tokyo, JP;
Takahiro Yamada, Tokyo, JP;
Assignee:
DOWA Electronics Materials Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 12/00 (2006.01); H05K 1/09 (2006.01); B22F 1/00 (2006.01); H01B 1/22 (2006.01); C22C 5/06 (2006.01); B22F 9/08 (2006.01);
U.S. Cl.
CPC ...
C22C 12/00 (2013.01); C22C 5/06 (2013.01); H01B 1/22 (2013.01);
Abstract
To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 μm to 10 μm, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.