The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Aug. 21, 2015
Applicant:
Bando Chemical Industries, Ltd., Kobe-shi, Hyogo, JP;
Inventors:
Assignee:
Bando Chemical Industries, Ltd., Hyogo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); F28F 21/06 (2006.01); H01L 23/42 (2006.01); H05K 7/20 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); F28F 21/06 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H05K 7/209 (2013.01); F28F 2255/06 (2013.01); F28F 2255/20 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A thermally conductive resin molded article having a resin and a thermally conductive filler is provided. The thermally conductive filler is oriented substantially in the thickness direction of the thermally conductive resin molded article. The volumetric filling factor of the thermally conductive filler in the thermally conductive resin molded article is 20-80% by volume. Weld lines in the resin are formed substantially in the thickness direction of the thermally conductive resin molded article. An oil component is included in the thermally conductive resin molded article.