The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Jun. 17, 2012
Applicants:

Li-sheng Wang, Azusa, CA (US);

Anthony R. Stephen, South Pasadena, CA (US);

Paul W. Boothe, Brooklyn, NY (US);

Tessa Schulze, Altadena, CA (US);

Michael A. Giardello, Pasadena, CA (US);

Mark S. Trimmer, Monrovia, CA (US);

Christopher J. Cruce, Poway, CA (US);

Farshad J. Motamedi, Claremont, CA (US);

Brian Edgecombe, Anaheim, CA (US);

Inventors:

Li-Sheng Wang, Azusa, CA (US);

Anthony R. Stephen, South Pasadena, CA (US);

Paul W. Boothe, Brooklyn, NY (US);

Tessa Schulze, Altadena, CA (US);

Michael A. Giardello, Pasadena, CA (US);

Mark S. Trimmer, Monrovia, CA (US);

Christopher J. Cruce, Poway, CA (US);

Farshad J. Motamedi, Claremont, CA (US);

Brian Edgecombe, Anaheim, CA (US);

Assignee:

Materia, Inc., Pasadena, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03C 25/30 (2018.01); C08K 5/00 (2006.01); C08K 5/14 (2006.01); C08K 5/29 (2006.01); C08F 32/02 (2006.01); C08G 61/08 (2006.01);
U.S. Cl.
CPC ...
C03C 25/30 (2013.01); C08F 32/02 (2013.01); C08K 5/0025 (2013.01); C08K 5/14 (2013.01); C08K 5/29 (2013.01); C08G 61/08 (2013.01); C08G 2261/3325 (2013.01); C08G 2261/418 (2013.01); C08K 2201/014 (2013.01);
Abstract

This invention relates to compositions and methods for improving the adhesion of resin compositions to substrate materials, pre-treating substrate materials to improve the adhesion of resin compositions to the substrate materials, and/or controlling gel formation of resin compositions. More particularly, the invention relates to compositions and methods for improving the adhesion of ring opening metathesis polymerization (ROMP) compositions to substrate materials using adhesion promoters containing isocyariate groups in a resin composition. The invention also relates to methods for improving the adhesion of resin compositions to substrate materials by pre-treating substrate materials with adhesion promoters containing isocyanate groups. The invention further relates to a method of providing a gel-modified ROMP composition, in which a hydroperoxide is added to a ROMP polymerizable resin composition in order to control gel formation of the polymerizing resin. An improved ROMP composition is further disclosed, comprising a cyclic olefin, a ROMP metathesis catalyst, an adhesion promoter, and an added hydroperoxide gel modifier. The polymer products produced via ROMP reactions of the invention may be utilized for a wide range of materials and composite applications. The invention has utility in the fields of catalysis, organic synthesis, and polymer and materials chemistry and manufacture.


Find Patent Forward Citations

Loading…