The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Oct. 29, 2015
Corning Incorporated, Corning, NY (US);
Heather Debra Boek, Corning, NY (US);
Leonard Charles Dabich, II, Painted Post, NY (US);
David Alan Deneka, Corning, NY (US);
Jin Su Kim, Painted Post, NY (US);
Shari Elizabeth Koval, Beaver Dams, NY (US);
Stephan Lvovich Logunov, Corning, NY (US);
Mark Alejandro Quesada, Horseheads, NY (US);
Alexander Mikhailovich Streltsov, Corning, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σ)/(σ))<<1 or <1 and σ>10 MPa or >1 MPa where σis the stress present in the first substrate and σis the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.