The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Apr. 03, 2018
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Jayaganasan Narayanasamy, Melaka, MY;

Jagen Krishnan, Melaka, MY;

Sanjay Kumar Murugan, Malacca, MY;

Hong Lim Lee, Penang, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/58 (2006.01); B29C 70/78 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); H01L 23/433 (2006.01); B29L 31/34 (2006.01); B29K 509/04 (2006.01);
U.S. Cl.
CPC ...
B29C 70/58 (2013.01); B29C 70/78 (2013.01); H01L 21/4803 (2013.01); H01L 21/4871 (2013.01); H01L 23/373 (2013.01); H01L 23/3733 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 23/433 (2013.01); H01L 23/49568 (2013.01); B29K 2509/04 (2013.01); B29L 2031/34 (2013.01); H01L 2924/181 (2013.01);
Abstract

A method for forming a matrix composite layer on a workpiece and a workpiece with a matrix composite layer are disclosed. In an embodiment the method includes forming a wall around a metallic surface such that the wall extends in a vertical direction from a plane formed by the metallic surface, and depositing a filler material in a walled area on the metallic surface. The method further includes depositing a plastic material on the filler material and performing a vacuum treatment of the filler material and the plastic material thereby forming a matrix composite layer disposed on the metallic surface.


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