The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Nov. 25, 2015
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
The bonding apparatus of the present invention is an apparatus that bonds a patch containing a reinforcing fiber to a bonded section of a corner section CR of an object member. The bonding apparatus has s heater mat, a pushing member, a bag member having a decompression port, a mold releasing film, a breather, a heater mat and a sealant. A pushing member has a first cowl plate, a second cowl plate and an elastic pressuring body. A pressuring section of the pushing member has the surface shape corresponding to a corner section design value after the patch is bonded. By protruding from a gap between a first cowl plate and a second cowl plate to a direction of the corner section CR, the patch is pushed to the bonded section and the generation of a wrinkle in the reinforcing fiber can be prevented.