The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Sep. 08, 2017
Applicant:
Tamura Corporation, Tokyo, JP;
Inventors:
Masaya Arai, Iruma, JP;
Takeshi Nakano, Iruma, JP;
Atsushi Hori, Iruma, JP;
Tsukasa Katsuyama, Iruma, JP;
Yurika Munekawa, Iruma, JP;
Assignee:
TAMURA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 13/00 (2006.01); H05K 3/34 (2006.01); C22C 13/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/26 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H05K 3/3457 (2013.01);
Abstract
A lead-free solder alloy includes 1% by weight or more and 4% by weight or less of Ag, 1% by weight or less of Cu, 3% by weight or more and 5% by weight or less of Sb, 0.01% by weight or more and 0.25% by weight or less of Ni, and Sn.
Arai, Masaya. (2019). Lead-free solder alloy, electronic circuit substrate, and electronic device (U.S. Patent No. 10456872). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10456872
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile