The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Aug. 21, 2015
Applicant:
Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;
Inventors:
Assignee:
Heraeus Deutschland GmbH & Co. KG, Hanau, DE;
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 9/02 (2006.01); B23K 35/30 (2006.01); B23K 35/362 (2006.01); B23K 35/02 (2006.01); B23K 1/00 (2006.01); C22C 9/04 (2006.01); C22C 13/00 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/302 (2013.01); B23K 35/362 (2013.01); C22C 9/02 (2013.01); C22C 9/04 (2013.01); C22C 13/00 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); H05K 1/181 (2013.01); H05K 3/3484 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/20106 (2013.01); H01L 2924/20107 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01);
Abstract
A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ≤500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ≤15 μm.