The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Mar. 22, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Shigeru Tago, Nagaokakyo, JP;

Kuniaki Yosui, Nagaokakyo, JP;

Yuki Ito, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 3/32 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 7/00 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); H05K 1/0271 (2013.01); H05K 1/116 (2013.01); H05K 3/0011 (2013.01); H05K 3/46 (2013.01); H05K 3/4632 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/3436 (2013.01); H05K 3/4069 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/0285 (2013.01);
Abstract

A resin substrate includes a thermoplastic resin base body, a mounting land conductor on a surface of the resin base body to be connected to a component, first and second reinforcement conductor patterns, and first interlayer connection conductors. The first and second reinforcement conductor patterns are each embedded in the resin base body and have a planar shape that includes a position overlapping the mounting land conductor when viewing the resin base body in plan view. The first interlayer connection conductors connect the first and second reinforcement conductor patterns in a thickness direction of the resin base body. The first interlayer connection conductors are arranged at positions different from the mounting land conductor when viewing the resin base body in plan view.


Find Patent Forward Citations

Loading…