The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Jul. 18, 2018
Applicant:

Tactotek Oy, Oulunsalo, FI;

Inventors:

Antti Keranen, Oulunsalo, FI;

Ronald Haag, Oulunsalo, FI;

Mikko Heikkinen, Oulunsalo, FI;

Assignee:

TACTOTEK OY, Oulunsalo, FI;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H05K 1/0203 (2013.01); H05K 3/284 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A method for manufacturing a multilayer structure includes obtaining a first substrate film for accommodating electronics, providing circuitry on at least the second side of the first substrate film, forming the first substrate film to at least locally or more widely exhibit a selected non-planar three-dimensional shape subsequent to providing at least a portion of the circuitry on the at least the second side of the first substrate film, and melding plastic material on the first side of the first substrate film so as to at least partially cover the first side of the first substrate film.


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