The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Jan. 16, 2019
Mdm Inc., Daegu, KR;
Ku Yong Kim, Incheon, KR;
MDM INC., Daegu, KR;
Abstract
An embodiment of the present invention provides a PCB module comprising: a multilayer PCB assembly including a heat dissipation plate layer, and an upper PCB and a lower PCB which are attached to the upper surface and the lower surface of the heat dissipation plate layer, respectively; and an upper case and a lower case for covering the upper side and the lower side of the multilayer PCB assembly, respectively, wherein the heat dissipation plate layer includes a plurality of electrically insulating heat dissipation plates arranged on the same plane, and at least one of the plurality of heat dissipation plates comprises: a first heat pole in thermal contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole in thermal contact with the inner surface of at least one of the upper and lower cases.