The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Mar. 23, 2018
Juniper Networks, Inc., Sunnyvale, CA (US);
David P. Chengson, Aptos, CA (US);
Juniper Networks, Inc., Sunnyvale, CA (US);
Abstract
An apparatus may include via pads and grid array pads associated with facilitating a connection through a package and to a component, and vias that are electrically connected to the via pads, wherein the vias are used to support high-speed differential signal pairs that are capable of causing crosstalk onto other high-speed differential signal pairs while propagating through the package. The apparatus may include interconnects that electrically connect the vias to the grid array pads, and that are capable of routing the high-speed differential signal pairs in a way that offsets the crosstalk that the high-speed differential signal pairs are capable of causing while propagating through the package. The apparatus may include additional interconnects that electrically connect the vias to additional vias that are to be used to facilitate routing the high-speed differential signal pairs to the component, without the high-speed differential signal pairs propagating through a printed circuit board.