The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Sep. 14, 2015
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Junichi Muramoto, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/232 (2006.01); G06T 3/40 (2006.01); H04N 5/247 (2006.01); H04N 5/225 (2006.01); H04N 5/262 (2006.01);
U.S. Cl.
CPC ...
H04N 5/23238 (2013.01); G06T 3/4038 (2013.01); H04N 5/2258 (2013.01); H04N 5/247 (2013.01); H04N 5/2628 (2013.01); G06T 2200/32 (2013.01);
Abstract

The present disclosure relates to a signal processing circuit and an imaging apparatus by which a plurality of images including an overlapping region can be accurately stitched. Stitching (projective transformation and warping) is performed on direct-transformation region images on the basis of camera initial condition information (information on directions of camera modules) stored in an EEPROM. Stitching is performed on overlapping-region images under the determined composition condition. Stitching is performed on buffer region images by the use of a value (e.g., moderate value) determined on the basis of a projective transformation condition of the direct-transformation region images and a projective transformation condition of the overlapping-region images. The present disclosure is applicable to, for example, a signal processing circuit used in an imaging apparatus such as a camera.


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