The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Nov. 04, 2015
Omnivision Technologies, Inc., Santa Clara, CA (US);
Tsung-Wei Wan, HsinChu, TW;
Wei-Ping Chen, New Taipei, TW;
OmniVision Technologies, Inc., Santa Clara, CA (US);
Abstract
A wafer-level method for packaging a plurality of camera modules includes (a) overmolding a first housing material around a plurality of image sensors to produce a first wafer of packaged image sensors, (b) seating a plurality of lens units in the first wafer above the plurality of image sensors, respectively, and (d) overmolding a second housing material over the first wafer and around the lens units to form a second wafer of packaged camera modules, wherein each of the packaged camera modules includes one of the image sensors and one of the lens units, and the second housing material cooperates with the first housing material to secure the lens units in the second wafer.