The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Mar. 10, 2017
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Tomoya Miura, Kariya, JP;

Yuu Yamahira, Kariya, JP;

Kazuma Fukushima, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 7/00 (2006.01); H02M 1/088 (2006.01); H02P 27/06 (2006.01); H02M 7/5387 (2007.01); H01L 23/46 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); H02M 1/088 (2013.01); H02M 7/5387 (2013.01); H02P 27/06 (2013.01); H01L 23/46 (2013.01);
Abstract

A plurality of semiconductor elements and a control circuit unit are provided. The plurality of semiconductor elements which are connected in parallel are configured to perform switching at the same time. The control circuit unit includes a drive circuit connected to the plurality of semiconductor elements which perform operation at the same time, control wirings and reference wirings. The control wirings connect control electrodes of the semiconductor elements to the drive circuit. The reference wirings connect reference electrodes of the semiconductor elements to the drive circuit. A parasitic inductance in the reference wiring is made smaller than a parasitic inductance in the control wiring.


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