The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Feb. 17, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Tatsuya Kitamura, Tokyo, JP;
Kohei Onda, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Chiyoda-ku, Tokyo, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 7/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H02M 7/48 (2007.01); H05K 7/06 (2006.01); H02M 7/44 (2006.01); H05K 5/06 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H02M 7/44 (2013.01); H02M 7/48 (2013.01); H05K 5/064 (2013.01); H05K 7/06 (2013.01); H05K 7/209 (2013.01); H05K 7/2089 (2013.01);
Abstract
A power conversion device that supplies power to a load using a module incorporating a semiconductor element is such that a sealing wall that holds a sealing resin is provided on a metal case that cools the module, a feedback current channel, which is one wiring member forming a current channel that passes into and out of the semiconductor element, is the metal case, and another wiring member is disposed in proximity to and parallel with the sealing wall of the metal case.